sipengchao

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Gender:Male
Date of Employment:2010-10-22

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芯片封装用低膨胀系数电子基材关键技术研发

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Affiliation of Participant(s):材料科学与工程学院
Leading Scientist:司鹏超
Nature of Project:横向
Project Number:D3DBFC6C591E4801E053BE07C2CAA686
Date of Project Approval:2021-12-22
Scheduled completion time:2023-12-31
Date of Project Completion:2023-12-31
Date of Project Initiation:2021-12-22