Project Name:芯片封装用低膨胀系数电子基材关键技术研发
Institution:材料科学与工程学院
Leading Scientist:司鹏超
Nature of Project:横向
Project Number:D3DBFC6C591E4801E053BE07C2CAA686
Date of Project Approval:2021-12-22
Scheduled Completion Time:2024-12-31
Date of Project Completion:2024-12-31
Date of Project Initiation:2021-12-22
Release Time:2022-05-27