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A novel heat-resistant Al–Si–Cu–Ni–Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons

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Affiliation of Author(s): : 材料科学与工程学院

Title of Paper: : A novel heat-resistant Al–Si–Cu–Ni–Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons

Journal: : JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

All the Authors: : sunqianqian,Tong Gao

First Author: : Liu Xiangfa

Indexed by: : Unit Twenty Basic Research

Document Code: : FA8984A3B48D4553B3B8E64668F1B05A

Translation or Not: : no

Date of Publication: : 2019-03-14

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Gender : Male

Status : Employed

School/Department : 材料科学与工程学院

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