山东大学教师主页孙谦谦 A novel heat-resistant Al–Si–Cu–Ni–Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons Home

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A novel heat-resistant Al–Si–Cu–Ni–Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons

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Institution:材料科学与工程学院

Title of Paper:A novel heat-resistant Al–Si–Cu–Ni–Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons

Journal:JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

First Author:Liu Xiangfa

All the Authors:孙谦谦,Tong Gao,Liu Xiangfa

Document Code:FA8984A3B48D4553B3B8E64668F1B05A

Translation or Not:No

Date of Publication:2019-03

Release Time:2019-10-25

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Personal information

Gender : Male

School/Department : 材料科学与工程学院

Faculty/School : School of Materials Science & Engineering

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