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Title:用于平滑并网变流器IGBT模块结温波动的方法及系统
Institution:控制科学与工程学院
Type of Patent:Invent
Application Number:202311830616.7
Number of Inventors:4
Service Invention or Not:No
Application Date:2023-12-27
Publication Date:2025-04-04
Authorization Date:2025-04-04
Release Time:2025-07-11