Project Name:高密度封装基板热阻测试分析
Institution:信息科学与工程学院
Leading Scientist:王卿璞
Supported by:中国科学院微电子研究所
Nature of Project:横向
Project Participants:王卿璞
Project Number:kyxm-60872
Project Approval Number:11131519
Date of Project Approval:2015-05-30
Scheduled Completion Time:2017-12-30
Date of Project Completion:2017-12-30
Date of Project Initiation:2015-05-30
Release Time:2019-04-18