wangqingpu
+
Doctor
With Certificate of Graduation for Doctorate Study
山东大学
Personal Information
Gender:Male
Date of Employment:1987-07-01
Business Address:高新区软件校区微电子学院3B202室
Doctor
With Certificate of Graduation for Doctorate Study
山东大学
Gender:Male
Date of Employment:1987-07-01
Business Address:高新区软件校区微电子学院3B202室
Project Name:高密度封装基板热阻研究
Institution:集成电路学院
Leading Scientist:王卿璞
Supported by:Shandong Shengpin Electronic Technology Co., Ltd.
Nature of Project:横向
Project Participants:王卿璞
Project Number:kyxm-65680
Project Approval Number:12231701
Date of Project Approval:2017-07-22
Scheduled Completion Time:2022-10-01
Date of Project Completion:2022-10-01
Date of Project Initiation:2017-07-22
Release Time:2019-04-18