王守志
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一种亚表面无损伤氮化镓晶片的加工工艺
  • Title:
    一种亚表面无损伤氮化镓晶片的加工工艺
  • Institution:
    新一代半导体材料研究院
  • Type of Patent:
    Invent
  • Application Number:
    202211524369.3
  • Number of Inventors:
    5
  • Service Invention or Not:
    No
  • Application Date:
    2022-11-30
  • Publication Date:
    2024-10-15
  • Authorization Date:
    2024-10-15
  • Release Time:
    2024-10-17
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