王守志
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一种亚表面无损伤氮化镓晶片的加工工艺
  • Affilication of Author(s):
    新一代半导体材料研究院
  • Type of Patent:
    发明
  • Application Number:
    202211524369.3
  • Number of Inventors:
    5
  • Service Invention or Not:
    no
  • Application Date:
    2022-11-30
  • Publication Date:
    2024-10-15
  • Authorization Date:
    2024-10-15

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