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Title:一种应用于3D集成电路的散热装置
Institution:热科学与工程研究中心
Type of Patent:发明
Application Number:201811391672.4
Number of Inventors:4
Service Invention or Not:No
Application Date:2018-11-21
Publication Date:2019-07-12
Authorization Date:2019-07-12
Release Time:2019-04-15