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Title:一种金属-SAM-有机半导体复合结构及制备方法和电子器件中的应用
Institution:热科学与工程研究中心
Type of Patent:Invent
Application Number:202010285270.7
Number of Inventors:1
Service Invention or Not:No
Application Date:2020-04-13
Publication Date:2022-04-22
Authorization Date:2022-04-22
Release Time:2021-05-27