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Title:TEC热能驱动的环路热管无泵循环芯片散热装置及方法
Type of Patent:Invent
Application Number:202311166792.5
Number of Inventors:4
Service Invention or Not:No
Application Date:2023-09-11
Publication Date:2024-07-09
Authorization Date:2024-07-09
Release Time:2024-07-23