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A Novel Thermally Evaporated Etching Mask for Low-Damage Dry Etching

Release time:2019-10-24
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Affiliation of Author(s):
集成电路学院
Journal:
IEEE Transactions on Nanotechnology
All the Authors:
Yiming Wang,wangqingpu,xinqian,hanlin,Song A M
First Author:
王汉斌
Document Code:
E56E2B7ED1104702BAEB516FA27F194D
Volume:
16
Issue:
2
Page Number:
290
Translation or Not:
no
Date of Publication:
2017-03-01