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A Novel Thermally Evaporated Etching Mask for Low-Damage Dry Etching

Release Time:2019-10-24
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Institution:
集成电路学院
Title of Paper:
A Novel Thermally Evaporated Etching Mask for Low-Damage Dry Etching
Journal:
IEEE Transactions on Nanotechnology
First Author:
王汉斌
All the Authors:
王一鸣,王卿璞,辛倩,韩琳,Song A M
Document Code:
E56E2B7ED1104702BAEB516FA27F194D
Volume:
16
Issue:
2
Page Number:
290
Translation or Not:
No
Date of Publication:
2017-03
Release Time:
2019-10-24