Jiang Wu
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Paper Publications
Dynamic modeling and analysis of wafers in near-field acoustic levitation
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Affiliation of Author(s): : 控制科学与工程学院

Title of Paper: : Dynamic modeling and analysis of wafers in near-field acoustic levitation

First Author: : 王立鹏

Document Code: : 1823289252571111425

Page Number: : 1023-1028

Number of Words: : 3

Translation or Not: : no

Date of Publication: : 2024-01-01

Personal information

Professor

Gender : Male

Alma Mater : 东京工业大学

Education Level : With Certificate of Graduation for Doctorate Study

Degree : Doctoral Degree in Engineering

School/Department : 控制科学与工程学院

Date of Employment : 2021-01-07

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