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Influences of hard inclusions on processing stress in diamond multi-wire sawing multi-crystalline silicon

Release Time:2022-05-28 Hits:

Institution:机械工程学院
Journal:Materials Science in Semiconductor Processing
First Author:程大猛
Document Code:CC396E8598334DB69377C1DD2EC1B832
Issue:144
Page Number:106602
Number of Words:8
Translation or Not:No
Date of Publication:2022-06

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