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Gender:Female
Date of Employment:2003-07-16

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[1] 王柯颖. Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon. MATERIALS, 17, 553, 2024.
[2] 姜千青. Analysis of crack initiation load and stress field in double scratching of single crystal gallium nitride. Engineering fracture mechanics, 2022.
[3] 葛培琪. 基于机械综合实验的团队教学改革与实践. 实验室研究与探索, 33, 205-208, 2014.
[4] 蒲天钊. Simulation analysis of cutting coolant flow field in fixed and free abrasive combined wire sawing polysilicon. INTERNATIONAL JOURNAL OF ADVANCED MAN..., 7711, 2022.
[5] 程大猛. Influences of hard inclusions on processing stress in diamond multi-wire sawing multi-crystalline silicon. Materials Science in Semiconductor Pr..., 106602, 2022.
[6] 刘润涛. Wet sandblasting pretreatment of diamond wire sawn multi-crystalline silicon wafer for surface acid texturization in photovoltaics. Journal of Materials Science: Materia..., 33, 3676, 2022.
[7] 刘润涛. Surface properties of diamond wire sawn photovoltaic mc-Si wafers by stirred slurry pretreated and additive-free acid textured. SURFACE TOPOGRAPHY-METROLOGY AND PROP..., 10, 2022.
[8] Yihe Liu. Analysis of sawing characteristics of fine diamond wire slicing multicrystalline silicon. Diamond and Related Materials, 108708, 2021.
[9] 张磊. Research on material removal mechanism and radial cracks during scribing single crystal gallium nitride. Ceramics International, 47, 15155, 2021.
[10] 张磊. An analytical model for estimation of the stress field and cracks caused by scratching anisotropic single crystal gallium nitride. Materials Science in Semiconductor Pr..., 2021.

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