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Date of Employment:2003-07-16

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Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon

Date of Publication:2024-02-01 Hits:

Affiliation of Author(s):机械工程学院
Journal:MATERIALS
First Author:王柯颖
Document Code:5898A4207AC643298014D6FCDC2951D7
Volume:17
Issue:3
Page Number:553
Number of Words:8
Translation or Not:no
Date of Publication:2024-02-01

Next One:Analysis of crack initiation load and stress field in double scratching of single crystal gallium nitride

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