Paper Publications

Home >> Scientific Resear... >> Paper Publication...

High-Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion

Release time:2023-12-07|Hits:

Affiliation of Author(s):能源与动力工程学院

Journal:Advanced Materials Interfaces

First Author:王健

Document Code:1610220791983292418

Volume:10

Issue:4

Number of Words:4

Translation or Not:no

Date of Publication:2022-12-01

Pre One:
Influence of Temperature and Current Stressing on Cu-Sn Intermetallic Compound Growth Characteristics of Lead-Free Microbump
Next One:
Deep learning molecular dynamics simulation on microwave high-temperature dielectric function of silicon nitride

中文    |   MOBILE Version   |   Login SDU   

Copyright All Rights Reserved Shandong University Address: No. 27 Shanda South Road, Jinan City, Shandong Province, China: 250100
Information desk: (86) - 0531-88395114
On Duty Telephone: (86) - 0531-88364731 Construction and Maintenance: Information Work Office of Shandong University

Click: Times

The Open Time: --

The Last Update Time: --