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Influence of Temperature and Current Stressing on Cu-Sn Intermetallic Compound Growth Characteristics of Lead-Free Microbump

Release time:2023-12-07|Hits:

Affiliation of Author(s):能源与动力工程学院

Journal:Advanced Theory and Simulations

First Author:付志伟

Document Code:1637724144632020994

Volume:6

Issue:4

Number of Words:4

Translation or Not:no

Date of Publication:2023-02-01

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Thermal transport across copper-water interfaces according to deep potential molecular dynamics
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High-Temperature Degradation Mechanism of Interfacial Thermal Resistance Based on Submicron Silver Adhesion

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