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Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing

Release time:2023-12-07|Hits:

Affiliation of Author(s):能源与动力工程学院

Journal:Materials

First Author:付志伟

Document Code:1637724144460054529

Volume:16

Issue:3

Number of Words:4

Translation or Not:no

Date of Publication:2023-02-01

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Nontrivial role of polar optical phonons in limiting electron mobility of two-dimensional Ga2O3 from first-principles
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Thermal transport across copper-water interfaces according to deep potential molecular dynamics

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