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Thermal transport across copper-water interfaces according to deep potential molecular dynamics

Release time:2023-12-07|Hits:

Affiliation of Author(s):能源与动力工程学院

Journal:Physical chemistry chemical physics

First Author:李志强

Document Code:1637724203541020674

Volume:25

Issue:9

Page Number:6746-6756

Number of Words:4

Translation or Not:no

Date of Publication:2023-03-01

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Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing
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Influence of Temperature and Current Stressing on Cu-Sn Intermetallic Compound Growth Characteristics of Lead-Free Microbump

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