Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions
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Institution:机械工程学院
Title of Paper:Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions
Journal:International Journal of Machine Tools and Manufacture
First Author:Peng Yao
All the Authors:刘含莲,邹斌,朱洪涛,黄传真
Document Code:lw-185328
Volume:109
Page Number:126
Translation or Not:No
Date of Publication:2016-10
Release Time:2019-04-14