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Laser-Assisted Waterjet Microgrooving of Silicon Wafers for minimizing heat affected zone

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Affiliation of Author(s):机械工程学院

Journal:Materials science forum

All the Authors:zhuhongtao,Peng Yao

First Author:huangchuanzhen

Indexed by:Unit Twenty Basic Research

Document Code:lw-184163

Volume:861

Page Number:133

Translation or Not:no

Date of Publication:2016-09-15

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