9TkOnUvN0fGqbDmYtB5D5pN7eFnAiE2NCbZ18WHj09x3SEnNFsyic94YPudr
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Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions

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Institution:机械工程学院

Title of Paper:Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions

Journal:International Journal of Machine Tools and Manufacture

First Author:Peng Yao

All the Authors:黄传真,朱洪涛,邹斌,刘含莲,Peng Yao

Document Code:lw-185328

Volume:109

Page Number:126

Number of Words:7

Translation or Not:No

Date of Publication:2016-07

Release Time:2019-10-26

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