Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202010681980.1
Number of Inventors:4
Service Invention or Not:no
Application Date:2020-07-15
Publication Date:2022-05-31
Authorization Date:2022-05-31
Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202010681980.1
Number of Inventors:4
Service Invention or Not:no
Application Date:2020-07-15
Publication Date:2022-05-31
Authorization Date:2022-05-31