周宗青
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Patents
一种体现渗流对岩土体强度弱化的DEM接触模型构建方法
Release Time:2021-05-21| Hits:
Title:一种体现渗流对岩土体强度弱化的DEM接触模型构建方法
Institution:岩土与地下工程研究院
Type of Patent:Invent
Application Number:201911414054.1
Number of Inventors:2
Service Invention or Not:No
Application Date:2019-12-31
Publication Date:2021-04-13
Authorization Date:2021-04-13
Release Time:2021-05-21
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