周宗青
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Patents
一种体现渗流对岩土体强度弱化的DEM接触模型构建方法
2021-05-21 Hits:
Affilication of Author(s):岩土与结构工程研究中心
Type of Patent:发明
Application Number:201911414054.1
Number of Inventors:4
Service Invention or Not:no
Application Date:2019-12-31
Publication Date:2021-04-13
Authorization Date:2021-04-13
Publication Date:2021-04-13
Application Date:2019-12-31
Authorization Date:2021-04-13
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