周宗青
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Patents
一种体现渗流对岩土体强度弱化的DEM接触模型构建方法PCT
2024-10-23 Hits:
Type of Patent:发明
Application Number:US11977825B.2
Number of Inventors:7
Service Invention or Not:no
Application Date:2020-10-23
Publication Date:2024-05-07
Authorization Date:2024-05-07
Publication Date:2024-05-07
Application Date:2020-10-23
Authorization Date:2024-05-07
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