周宗青
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Patents
一种体现渗流对岩土体强度弱化的DEM接触模型构建方法PCT
Release Time:2024-10-23| Hits:
Title:一种体现渗流对岩土体强度弱化的DEM接触模型构建方法PCT
Type of Patent:Invent
Application Number:US11977825B.2
Number of Inventors:7
Service Invention or Not:No
Application Date:2020-10-23
Publication Date:2024-05-07
Authorization Date:2024-05-07
Release Time:2024-10-23
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