Institution:机械工程学院
Title of Paper:Intelligent identification of material removal behavior during scratching of 4H-SiC based on acoustic emission sensing and unsupervised deep learning
Journal:Materials Science in Semiconductor Processing
First Author:张瑞豪
Document Code:949D5A5A5FEA406C8F6DFA8DDCBE2689
Volume:190
Issue:1
Page Number:109358
Number of Words:4
Translation or Not:No
Date of Publication:2025-05
Release Time:2025-10-06
