Chenglu Gao
Associate Professor
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Patents
一种体现渗流对岩土体强度弱化的DEM接触模型构建方法PCT
  • Type of Patent:
    发明
  • Application Number:
    US11977825B.2
  • Number of Inventors:
    7
  • Service Invention or Not:
    no
  • Application Date:
    2020-10-23
  • Publication Date:
    2024-05-07
  • Authorization Date:
    2024-05-07

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