韩吉胜
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Roughness control in the processing of 2-inch polycrystalline diamond films on 4H-SiC wafers
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Institution:新一代半导体材料研究院

Title of Paper:Roughness control in the processing of 2-inch polycrystalline diamond films on 4H-SiC wafers

Journal:Materials Science in Semiconductor Processing

First Author:胡秀飞

Document Code:1833780037035331586

Volume:184

Number of Words:7

Translation or Not:No

Date of Publication:2024-12

Release Time:2025-01-16

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Gender : Male

School/Department : 新一代半导体材料研究院

Date of Employment : 2020-11-15

Faculty/School : Integrated Technical Breakthrough Platform for New-generation Semiconductive Materials

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