Title: : 一种半导体器件及其制造方法
Affilication of Author(s): : 新一代半导体材料研究院
Type of Patent: : 发明
Application Number: : 202311605620.3
Number of Inventors: : 5
Service Invention or Not: : no
Application Date: : 2023-11-29
Publication Date: : 2024-03-01
Authorization Date: : 2024-03-01
Gender : Male
School/Department : 新一代半导体材料研究院
Date of Employment : 2020-11-15
The Last Update Time : ..
