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New Chemically Amplified Positive Photoresist with Phenolic Resin Modified by GMA and BOC Protection

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Affiliation of Author(s):国家胶体材料工程技术研究中心

Journal:polymers

First Author:刘俊俊

Document Code:F7873BE2C65B41E680D1736493F86FE0

Issue:7

Number of Words:8000

Translation or Not:no

Date of Publication:2023-03-23

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