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    倒装芯片封装工艺研究—高精度视觉识别芯片分拣系统设计

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    • Project Name:倒装芯片封装工艺研究—高精度视觉识别芯片分拣系统设计

    • Institution:核科学与能源动力学院

    • Leading Scientist:刘江伟

    • Nature of Project:横向

    • Project Number:3602A5C50C382128E0635C00A8C00784

    • Date of Project Approval:2025-05-25

    • Scheduled Completion Time:2025-12-31

    • Date of Project Completion:2025-12-31

    • Date of Project Initiation:2025-05-25

    • Release Time:2025-06-06
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