倒装芯片封装工艺研究—高精度视觉识别芯片分拣系统设计

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Affiliation of Participant(s):核科学与能源动力学院
Leading Scientist:刘江伟
Nature of Project:横向
Project Number:3602A5C50C382128E0635C00A8C00784
Date of Project Approval:2025-05-25
Date of Project Initiation:2025-05-25
Scheduled completion time:2025-12-31
Date of Project Completion:2025-12-31

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