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Affiliation of Author(s):Shandong University, Weihai

Journal:Sensors

Key Words:microelectrochemicalmilling;ultrasonicvibration;surfacequality;machininglocalization; microstructures

Abstract:With the rapid development of MEMS, the demand for metal microstructure is increasing. Micro electrochemical milling technology (MECM) is capable of manufacturing micro metallic devices or components based on the principle of electrochemical anode dissolution. To improve the capacity of MECM, this paper presents a compound method named ultrasonic vibration-assisted micro electrochemical milling technology (UA-MECM). Firstly, the simulation and mathematical model of UA-MECM process is established to explain the mechanism of ultrasonic vibration on micro electrochemical milling. Then, the effects of ultrasonic parameters, electrical parameters and feedrate on machining localization and surface quality are discussed considering sets of experiments. The surface roughness was effectively reduced from Ra 0.83 to Ra 0.26 µm with the addition of ultrasonic vibration. It turns out that ultrasonic vibration can obviously improve machining precision, efficiency and quality. Finally, two- and three-dimensional microstructures with good surface quality were successful fabricated. It shows that ultrasonic vibration-assisted electrochemical milling technology has excellent machining performance, which has potential and broad industrial application prospects.

All the Authors:HaoranChen, Shenghai Wang , Kan Wang, Minghao Li,Tengfei Peng

First Author:Yong Liu

Indexed by:Research Paper

Correspondence Author:Yong Liu

Document Code:10.3390/s20226617

Document Type:Journal article

Volume:20

Issue:22

Page Number:6617

ISSN No.:1424-8220

Translation or Not:no

Date of Publication:4417-04-01