Hits:

Institution:Shandong University, Weihai

Title of Paper:Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode

Journal:Micromachines

Key Words:wire electrochemical micromachining; ultrasonic-assisted; machining localization; surface roughness; micro gear

Summary:Wire electrochemical micromachining (WECMM) technology is regarded a promising method to fabricate high aspect ratio microstructures on hard-to-machining materials, however, the by-product accumulation in the machining gap limits its application. In this paper, a new method called ultrasonic-assisted wire electrochemical micromachining (UA-WECMM) is proposed to improve the machining performance of WECMM. Firstly, a flow-field simulation in the machining gap was carried out; the results showed that the ultrasonic vibration of electrode can remarkably enhance the mass transport in the machining gap and improve the machining condition. Secondly, experiments were performed to confirm the effect of ultrasonic vibration, which illustrated that the vibration with proper amplitude can reduce the slit width and improve the morphology of machined surface. Moreover, the influence of other machining parameters were also discussed. Finally, a T-type micro connector with good surface roughness (Ra 0.286 μm) was fabricated on a 300-μm-thick 304 stainless steel workpiece and a micro gear (diameter: 3.362 mm; Ra: 0.271 μm) with an aspect ratio of 7 was fabricated on a 2-mm-thick workpiece. It is proved that the proposed ultrasonic-assisted wire electrochemical micromachining method has considerable potential and broad application prospects.

First Author:Siying Ling

Correspondence Author:Yong Liu

All the Authors: Yong Jiang, Kan Wang, Yong Liu,Minghao Li

Document Code:10.3390/mi11070698

Document Type:Journal article

Volume:11

Issue:7

Page Number:698

ISSN:2072-666X

Translation or Not:No

Date of Publication:4403-01

Release Time:2025-05-14