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所属单位：Shandong University, Weihai

发表刊物：Sensors

关键字：microelectrochemicalmilling;ultrasonicvibration;surfacequality;machininglocalization; microstructures

摘要：With the rapid development of MEMS, the demand for metal microstructure is increasing. Micro electrochemical milling technology (MECM) is capable of manufacturing micro metallic devices or components based on the principle of electrochemical anode dissolution. To improve the capacity of MECM, this paper presents a compound method named ultrasonic vibration-assisted micro electrochemical milling technology (UA-MECM). Firstly, the simulation and mathematical model of UA-MECM process is established to explain the mechanism of ultrasonic vibration on micro electrochemical milling. Then, the effects of ultrasonic parameters, electrical parameters and feedrate on machining localization and surface quality are discussed considering sets of experiments. The surface roughness was effectively reduced from Ra 0.83 to Ra 0.26 µm with the addition of ultrasonic vibration. It turns out that ultrasonic vibration can obviously improve machining precision, efficiency and quality. Finally, two- and three-dimensional microstructures with good surface quality were successful fabricated. It shows that ultrasonic vibration-assisted electrochemical milling technology has excellent machining performance, which has potential and broad industrial application prospects.

全部作者：HaoranChen, Shenghai Wang , Kan Wang, Minghao Li,Tengfei Peng

第一作者：Yong Liu

论文类型：Research Paper

通讯作者：Yong Liu

论文编号：10.3390/s20226617

文献类型：Journal article

卷号：20

期号：22

页面范围：6617

ISSN号：1424-8220

是否译文：否

发表时间：4417-04-01