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所属单位：Shandong University, Weihai

发表刊物：Micromachines

关键字：wire electrochemical micromachining; ultrasonic-assisted; machining localization; surface roughness; micro gear

摘要：Wire electrochemical micromachining (WECMM) technology is regarded a promising method to fabricate high aspect ratio microstructures on hard-to-machining materials, however, the by-product accumulation in the machining gap limits its application. In this paper, a new method called ultrasonic-assisted wire electrochemical micromachining (UA-WECMM) is proposed to improve the machining performance of WECMM. Firstly, a flow-field simulation in the machining gap was carried out; the results showed that the ultrasonic vibration of electrode can remarkably enhance the mass transport in the machining gap and improve the machining condition. Secondly, experiments were performed to confirm the effect of ultrasonic vibration, which illustrated that the vibration with proper amplitude can reduce the slit width and improve the morphology of machined surface. Moreover, the influence of other machining parameters were also discussed. Finally, a T-type micro connector with good surface roughness (Ra 0.286 μm) was fabricated on a 300-μm-thick 304 stainless steel workpiece and a micro gear (diameter: 3.362 mm; Ra: 0.271 μm) with an aspect ratio of 7 was fabricated on a 2-mm-thick workpiece. It is proved that the proposed ultrasonic-assisted wire electrochemical micromachining method has considerable potential and broad application prospects.

全部作者：Minghao Li, Yong Liu, Kan Wang, Yong Jiang

第一作者：Siying Ling

论文类型：Research Paper

通讯作者：Yong Liu

论文编号：10.3390/mi11070698

文献类型：Journal article

卷号：11

期号：7

页面范围：698

ISSN号：2072-666X

是否译文：否

发表时间：4403-01-01