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Three-Dimensional (3D) Nondestructive Characterization of the Spatial Distribution and Complex Properties of Polytypes on 4H-SiC Wafers
Release Time:2025-02-18
  • Institution:
    光学高等研究中心
  • Journal:
    ACS Applied Electronic Materials
  • First Author:
    王猛达
  • Document Code:
    1843556221445050369
  • Volume:
    6
  • Issue:
    9
  • Page Number:
    6857-6867
  • Number of Words:
    8
  • Translation or Not:
    No
  • Date of Publication:
    2024-09
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