Three-Dimensional (3D) Nondestructive Characterization of the Spatial Distribution and Complex Properties of Polytypes on 4H-SiC Wafers

Release time:2025-02-18|Hits:

Affiliation of Author(s):光学高等研究中心

Journal:ACS Applied Electronic Materials

First Author:王猛达

Document Code:1843556221445050369

Volume:6

Issue:9

Page Number:6857-6867

Number of Words:8

Translation or Not:no

Date of Publication:2024-09-12