一种用于构件连接的高强度小孔的制备方法

Release time:2022-08-12|Hits:

Affilication of Author(s):材料科学与工程学院

Type of Patent:发明

Application Number:202110873094.3

Service Invention or Not:yes

Application Date:2021-07-30

Publication Date:2022-07-12

Authorization Date:2022-07-12