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半绝缘碳化硅单晶衬底的研究进展

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  • Affiliation of Author(s):新一代半导体材料研究院

  • Journal:《人工晶体学报》

  • First Author:彭燕

  • Document Code:2972EA3926F94F58B5F281E2AAF0DAF2

  • Issue:4

  • Number of Words:3000

  • Translation or Not:no

  • Date of Publication:2021-03-08

  • Date of Publication:2021-03-08
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