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基于Chiplet技术的先进封装工艺研究及应用

Release Time:2024-04-19
Hits:
Project Name:
基于Chiplet技术的先进封装工艺研究及应用
Institution:
集成电路学院
Leading Scientist:
郭庆磊
Nature of Project:
纵向
Project Number:
01DB6CBE543F378EE063BE07C2CA67D7
Project Approval Number:
2023TSGC0184
Date of Project Approval:
2023-07-01
Scheduled Completion Time:
2025-07-31
Date of Project Completion:
2025-07-31
Date of Project Initiation:
2023-07-01
Release Time:
2024-04-19

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