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一种嵌入式耐高温透明导电薄膜、其制备方法及应用

Release time:2021-11-15
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Affilication of Author(s):
微电子学院
Type of Patent:
发明
Application Number:
202010967804.4
Number of Inventors:
1
Service Invention or Not:
no
Application Date:
2020-09-15
Publication Date:
2022-07-01
Authorization Date:
2022-07-01