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yangchunfeng

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Gender:Female
Date of Employment:2003-07-16

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[11] 张磊. Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cu.... Semiconductor Science and Technology, 35, 2020.
[12] 尹佑康. Sawing characteristics of diamond wire cutting sapphire crystal based on tool life cycle. Ceramics International, 47, 26627, 2021.
[13] 刘雪飞. 齿轮轴的设计制造与检测综合实验模块化教学研究. 《工具技术》, 2021.
[14] yangchunfeng. 几何量公差与检测实验教学改革的研究. 中国机械, 239, 2014.
[15] zhanglei , yangchunfeng and 张磊. Analysis of Grinding Parameters on Hardness Layer Depth. Applied mechanics and materials, 37-38, 131, 2010.
[16] yangchunfeng and 张磊. Analysis of Grinding Parameters on Hardness Layer Depth. Applied mechanics and materials, 37-38, 131, 2010.
[17] yangchunfeng and 张磊. Analysis of Grinding Parameters on Hardness Layer Depth. Applied mechanics and materials, 37-38, 131, 2010.
[18] yangchunfeng. 几何量公差与检测实验教学改革的研究. 中国机械, 239, 2014.

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