Title:一种基于多孔宽禁带半导体材料的高温大功率超级电容器及其制备方法
Institution:新一代半导体材料研究院
Type of Patent:Invent
Application Number:202210167128.1
Number of Inventors:5
Service Invention or Not:No
Application Date:2022-02-23
Publication Date:2023-08-11
Authorization Date:2023-08-11
Release Time:2023-09-07