Title:一种亚表面无损伤氮化镓晶片的加工工艺
Institution:新一代半导体材料研究院
Type of Patent:Invent
Application Number:202211524369.3
Number of Inventors:5
Service Invention or Not:No
Application Date:2022-11-30
Publication Date:2024-10-15
Authorization Date:2024-10-15
Release Time:2024-10-17