杨春凤
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工程师
- 性别:女
- 在职信息:在职
- 所在单位:机械工程学院
- 入职时间: 2003-07-16
访问量:
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王柯颖.
Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon.
MATERIALS,
17,
553,
2024.
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姜千青.
Analysis of crack initiation load and stress field in double scratching of single crystal gallium nitride.
Engineering fracture mechanics,
2023.
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葛培琪.
基于机械综合实验的团队教学改革与实践.
实验室研究与探索中文核心期刊,
33,
205-208,
2023.
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蒲天钊.
Simulation analysis of cutting coolant flow field in fixed and free abrasive combined wire sawing polysilicon.
international Journal of Advanced Manufacturing Technology,
7711,
2022.
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程大猛.
Influences of hard inclusions on processing stress in diamond multi-wire sawing multi-crystalline silicon.
Materials Science in Semiconductor Processing,
106602,
2022.
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刘润涛.
Wet sandblasting pretreatment of diamond wire sawn multi-crystalline silicon wafer for surface acid texturization in photovoltaics.
Journal of Materials Science: Materials in Electronics,
33,
3676,
2022.