Release Time:2019-04-14 |
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毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
Fracture strength of silicon wafers sawn by fixed diamond wire saw
Institution:机械工程学院
Title of Paper:Fracture strength of silicon wafers sawn by fixed diamond wire saw
Journal:Solar Energy
First Author:刘腾云
All the Authors:葛培琪,毕文波
Document Code:75B279AD857342299534FB354EBF24B0
Volume: 157
Page Number:427
Translation or Not:No
Date of Publication:2017-11