Release Time:2019-10-24 |
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毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
Prediction of the thickness for silicon wafers sawn by diamond wire saw
Institution:机械工程学院
Title of Paper:Prediction of the thickness for silicon wafers sawn by diamond wire saw
Journal:Materials Science in Semiconductor Processing
First Author:刘腾云
All the Authors:葛培琪,毕文波
Document Code:9E8AE170A3CD435AA6FEE08E5E5DCCA7
Volume:71
Page Number:133
Translation or Not:No
Date of Publication:2017-11