Release Time:2019-10-24 |
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毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
Depth of cut for single abrasive and cutting force in resin bonded diamond wire sawing
Institution:机械工程学院
Title of Paper:Depth of cut for single abrasive and cutting force in resin bonded diamond wire sawing
Journal:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
First Author:刘腾云
All the Authors:葛培琪,高玉飞,毕文波
Document Code:BCEBAD6960914D9F9066C3B0013B1A01
Volume:88
Issue:5-
Page Number:1763
Translation or Not:No
Date of Publication:2017-02