Affiliation of Author(s):机械工程学院
Journal:Materials Science in Semiconductor Processing
All the Authors:zhuhongtao,huangchuanzhen,biwenbo
First Author:葛梦然
Indexed by:Applied Research
Document Code:D69D723355A24554B0F3140933DC1302
Volume:74
Page Number:261
Translation or Not:no
Date of Publication:2018-02-01
Date of Publication:2018-02-01
毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
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