Release Time:2019-10-24 |
Hits:
毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
Institution:机械工程学院
Title of Paper:Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
Journal:Materials Science in Semiconductor Processing
First Author:葛梦然
All the Authors:朱洪涛,黄传真,毕文波
Document Code:D69D723355A24554B0F3140933DC1302
Volume:74
Page Number:261
Translation or Not:No
Date of Publication:2018-02