Release Time:2019-10-25 |
Hits:
毕文波
+
Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
The Effect of Cut Depth and Distribution for Abrasives on Wafer Surface Morphology in Diamond Wire Sawing of PV Polycrystalline Silicon
Institution:机械工程学院
Title of Paper:The Effect of Cut Depth and Distribution for Abrasives on Wafer Surface Morphology in Diamond Wire Sawing of PV Polycrystalline Silicon
Journal:Materials Science in Semiconductor Processing
First Author:高玉飞
All the Authors:葛培琪,张磊,毕文波,高玉飞
Document Code:B3A1135D8F3E4BD5826925B205813F0E
Volume:91
Page Number:316
Translation or Not:No
Date of Publication:2019-03