Release Time:2019-10-25 |
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毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
Development of the manufacture equipment for resin bonded diamond abrasive wire saw
Institution:机械工程学院
Title of Paper:Development of the manufacture equipment for resin bonded diamond abrasive wire saw
First Author:葛培琪
All the Authors:毕文波,高玉飞,Zhu Zhenjie,葛培琪
Document Code:lw-135289
Volume:588-589
Page Number:1694
Translation or Not:No
Date of Publication:2012-09